Semiconductor device with asymmetric strained source/drain structure and fabrication method

ABSTRACT

A semiconductor device includes a substrate having an upper surface; a source region in the substrate; a drain region in the substrate and spaced apart from the source region; a channel region between the source region and the drain region; a gate structure on the channel region; m dislocations in the source region, wherein m is an integer greater than or equal to 1; and n dislocations in the drain region, wherein n is an integer greater than or equal to 0, and wherein m is greater than n.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to the field of semiconductor processtechnology, and more particularly to afield effect transistor having anasymmetric strained source/drain structure and a fabrication methodthereof.

2. Description of the Prior Art

As the size of semiconductor components continues to shrink, in order totake into account device performance, there maybe a design trade-offbetween, for example, drive current and junction leakage. For example,in a field effect transistor (FET) device, the source sidecharacteristic is that a small approximation yields a higher drivecurrent due to higher stress, and the drain side characteristic is thata smaller approximation causes a higher junction leakage.

In addition, semiconductor components such as FET devices typically usea vertical implant process to construct doped regions in the substrate.Therefore, the conventional device typically has a symmetricalsource/drain (S/D) structure in the substrate. It is a design challengeto optimize both the drive current and the junction leakage.

SUMMARY OF THE INVENTION

The invention provides an improved semiconductor structure and amanufacturing method thereof, which can simultaneously optimizecharacteristics including driving current and junction leakage of afield effect transistor device, thereby improving device performance.

One aspect of the invention provides a method of forming a semiconductorstructure. First, a substrate is provided, including an upper surface. Agate structure is disposed on the upper surface. A spacer is disposed ona sidewall of the gate structure. A first region (e.g., a source region)is located in the substrate. A second region (e.g., a drain region) islocated in the substrate. The first region and the second region are dryetched to form a first trench and a second trench, respectively. Thesecond region is masked. The first region is then wet etched through thefirst trench to form a widened first trench. A stress-inducing layer isthen formed in the widened first trench and in the second trench.

According to another embodiment of the present invention, a method offorming a semiconductor structure includes: providing a substrateincluding an upper surface, a gate structure disposed on the uppersurface, a spacer disposed on a sidewall of the gate structure, a firstregion in the substrate, and a second region in the substrate; maskingthe second region and amorphizing the first region, such that anamorphous layer is formed in the first region; depositing a stress layeron the substrate, wherein the stress layer conformally covers the gatestructure, the spacer, the first region and the second region; andrecrystallizing the amorphous layer, thereby forming a dislocation inthe first region.

Another aspect of the invention provides a semiconductor structurecomprising: a substrate having an upper surface; a first region locatedin the substrate; a second region located in the substrate and spacedapart from the first region; a channel region between the first regionand the second region; a gate structure located on the channel region; mdislocations located in the first region, wherein m is an integergreater than or equal to 1; and n dislocations located in the secondregion, wherein n is an integer greater than or equal to 0, and whereinm is greater than n.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 to FIG. 4 are cross-sectional views showing a method offabricating a PMOS transistor structure 1 according to an embodiment ofthe invention.

FIG. 5 to FIG. 11 are cross-sectional views showing a method offabricating an NMOS transistor structure according to another embodimentof the present invention.

FIG. 12 to FIG. 13 are schematic cross-sectional views showing a methodfor fabricating an NMOS transistor structure according to still anotherembodiment of the present invention.

FIG. 14 and FIG. 15 show variations in the structure of an NMOStransistor in some other embodiments of the present invention.

FIG. 16 to FIG. 21 are cross-sectional views showing a method offabricating an NMOS transistor structure 6 according to still anotherembodiment of the present invention.

DETAILED DESCRIPTION

In the following detailed description of the disclosure, reference ismade to the accompanying drawings, which form a part hereof, and inwhich is shown, by way of illustration, specific embodiments in whichthe invention may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention.

Other embodiments maybe utilized and structural, logical, and electricalchanges may be made without departing from the scope of the presentinvention. Therefore, the following detailed description is not to beconsidered as limiting, but the embodiments included herein are definedby the scope of the accompanying claims.

The invention discloses an improved field effect transistor (FET) deviceand a manufacturing method thereof, which can simultaneously optimizethe driving current and the junction leakage of the FET device andimprove the device performance.

Please refer to FIG. 1 to FIG. 4, which are cross-sectional viewsshowing a method of fabricating a PMOS transistor structure 1 accordingto an embodiment of the invention. As shown in FIG. 1, first, asubstrate 100, for example, a P-type germanium substrate is provided,but is not limited thereto. An N-type well 101 may be formed in thesubstrate 100. The substrate 100 includes an upper surface 100 a.According to an embodiment of the present invention, a gate structure 20is formed on the upper surface 100 a. For example, the gate structure 20comprises a polysilicon layer 210, a gate dielectric layer 220, and asilicon nitride cap layer 230, but is not limited thereto. A spacer 202,such as a silicon nitride spacer, may be provided on each sidewall ofthe gate structure 20, but is not limited thereto.

In addition, a first region 30 and a second region 40 are respectivelydisposed in the substrate 100 on opposite sides of the gate structure20. The first region 30 and the second region 40 are separated from eachother and do not overlap each other. A channel region 200 is formedbetween the first region 30 and a second region 40. According to anembodiment of the invention, the first region 30 serves as the sourceregion of the field effect transistor device and the second region 40serves as the drain region of the field effect transistor device.

According to an embodiment of the invention, a lightly doped drain (LDD)region 301 and an LDD region 401 are respectively disposed in the firstregion 30 and the second region 40. The LDD region 301 and the LDDregion 401 are disposed in the N-well 101. For example, the LDD region301 and the LDD region 401 may be P-type LDD regions.

As shown in FIG. 2, a dry etching process, for example, an anisotropicdry etching process or a reactive ion dry etching process, etc., isperformed to etch the substrate 100 of the first region 30 and thesecond region 40, and etch through the LDD region 301 and the LDD region401, thereby forming a first trench 310 and a second trench 410,respectively.

As shown in FIG. 3, the second region 40 is then masked. For example, amask layer 500, such as a silicon nitride layer, is blanket deposited onthe substrate 100, wherein the mask layer 500 covers the gate structure20, the spacers 202, the first region 30, and the second region 40.Next, a portion of the mask layer 500 is removed using a lithography andetching processes to reveal the first region 30. The remaining masklayer 500 covers the second region 40, the spacers 202 adjacent thesecond region 40, and portions of the gate structure 20.

Subsequently, a wet etching process is performed to wet etch the firstregion 30 via the first trench 310 to form a widened first trench 330.The wet etching process described above may involve the use of hydroxyl(OH) containing materials including, but not limited to, potassiumhydroxide, tetramethylammonium hydroxide (TMAH) or sodium hydroxide.According to an embodiment of the invention, the widened first trench330 may have a hexagonal cross-sectional profile. According to anembodiment of the invention, the widened first trench 330 may have abottom surface 330 a and a sidewall 330 b. For example, the bottomsurface 330 a and the sidewall 330 b may be a silicon surface of a <111>crystal orientation.

At this point, the widened first trench 330 formed in the first region30 slightly extends toward the region directly under the gate structure20 (i.e. the channel region 200). Since the second trench 410 in thesecond region 40 is not wet etched, there is no such structure.

Next, as shown in FIG. 4, after the first region 30 is wet-etched, theremaining mask layer 500 is removed, revealing the first region 30 andthe second region 40. Then, a stress-inducing layer 350 and astress-inducing layer 450, for example, a silicon germanium (SiGe)layer, are formed in the widened first trench 330 and the second trench410, respectively. According to an embodiment of the present invention,the stress-inducing layers 350, 450 may be formed using a selectiveepitaxial method, but are not limited thereto. Subsequently, ionimplantation for forming heavily doped source and the drain may beperformed to form a source heavily doped region 302 in the first region30 and a drain heavily doped region 402 in the second region 40. Forexample, the source heavily doped region 302 and the drain heavily dopedregion 402 can be P-type heavily doped regions.

As can be seen from FIG. 4, the volume of the stress-inducing layer 350in the first region 30 is larger than the volume of the stress-inducinglayer 450 in the second region 40, and the stress-inducing layer 350 iscloser to the channel region 200 directly below the gate structure 20,thereby forming an asymmetric strained source/drain structure, whichenables the source stress-inducing layer 350 to be closer to the channelregion 200 of the PMOS transistor structure 1, and can induce greaterstress in the channel region 200, thereby enhancing the drive current ofthe PMOS transistor structure 1.

On the other hand, the stress-inducing layer 450 of the second region 40can reduce the junction leakage of the drain terminal due to its smallervolume and larger distance between the stress-inducing layer 450 and thechannel region 200. Therefore, the present invention field effecttransistor with an asymmetric strained source/drain structure canoptimize both the drive current and the junction leakage.

FIG. 5 to FIG. 11 are cross-sectional views showing a method offabricating an NMOS transistor structure 2 according to anotherembodiment of the present invention, wherein the same or similarelements, structures, or material layers are designated by similarnumeral numbers.

As shown in FIG. 5, first, a substrate 100, for example, a P-typesilicon substrate is provided, but is not limited thereto. The substrate100 includes an upper surface 100 a. According to an embodiment of thepresent invention, a gate structure 20 is formed on the upper surface100 a. For example, the gate structure 20 comprises a polysilicon layer210, a gate dielectric layer 220, and a silicon nitride cap layer 230,but is not limited thereto. A spacer 202, such as a silicon nitridespacer, may be provided on each sidewall of the gate structure 20, butis not limited thereto.

In addition, a first region 30 and a second region 40 are respectivelydisposed in the substrate 100 on opposite sides of the gate structure20. The first region 30 and the second region 40 are separated from eachother and do not overlap each other. According to an embodiment of theinvention, the first region 30 serves as the source region of the fieldeffect transistor device and the second region 40 serves as the drainregion of the field effect transistor device.

According to an embodiment of the invention, an LDD region 301 and anLDD region 401 are respectively disposed in the first region 30 and thesecond region 40. For example, the LDD region 301 and the LDD region 401may be N-type LDD regions.

As shown in FIG. 6, next, the second region 40 is masked. For example,the second region 40 is completely covered by a photoresist pattern 600.The photoresist pattern 600 may only cover the second region 40, thespacers 202 adjacent to the second region 40, and portions of the gatestructure 20. Then, an ion implantation process 60 is performed toimplant dopants, for example, silicon (Si), germanium (Ge) or xenon (Xe)ions into the substrate 100 in the first region 30 to amorphize thefirst region 30, thereby forming an amorphous silicon layer 610 only inthe first region 30.

As shown in FIG. 7 and FIG. 8, a stress memorization technique (SMT)process is performed. For example, a stress film 70 is deposited on thesubstrate 100. The stress film 70 conformally covers the gate structure20, the spacers 202, the first region 30, the amorphous silicon layer610 in the first region 30, and the second region 40. According to anembodiment of the present invention, the stress film 70 may include asilicon nitride layer, a silicon oxide layer, or a silicon oxynitridelayer, but is not limited thereto. According to an embodiment of theinvention, the stress film 70 may have a tensile stress.

Subsequently, an annealing process is performed to recrystallize theamorphous layer 610, so that a dislocation 611 is formed only in thefirst region 30, as shown in FIG. 8. According to an embodiment of thepresent invention, the annealing process may be a two-step annealingprocess. For example, the temperature of the first-stage annealing isbetween 400 and 750° C., and the temperature of the second-stageannealing is greater than 900° C.

As shown in FIG. 9, the stress film 70 is then removed to reveal thesecond region 40. At this point, the dislocation 611 formed in the firstregion 30 can provide an appropriate tensile stress to the channelregion 200, thereby forming a strained source structure.

Moreover, in accordance with another embodiment of the presentinvention, the steps depicted through FIGS. 6-9 can be repeated suchthat a plurality of dislocations 611 are formed in the first region 30,as shown in FIG. 10, to increase the source tensile stress. Finally, ionimplantation for forming heavily doped source and the drain may beperformed to form a source heavily doped region 302 in the first region30 and a drain heavily doped region 402 in the second region 40. Forexample, the source heavily doped region 302 and the drain heavily dopedregion 402 may be N-type heavily doped regions, thus forming an NMOSfield effect transistor 2 having an asymmetric strained source/drainstructure, as shown in FIG. 11.

Please refer to FIG. 12 to FIG. 13, which are schematic cross-sectionalviews showing a method for fabricating an NMOS transistor structure 3according to still another embodiment of the present invention, in whichthe same or similar elements, structures or material layers aredesignated by the same numeral numbers. To simplify the description, thesteps of FIG. 12 are performed after the steps of FIG. 9.

As shown in FIG. 12, after the stress film 70 is removed, a trench 320may be formed in the first region 30. The trench 320 may be a trenchformed by an isotropic dry etch and may be adjacent to the spacer 202(or aligned with the outer sidewall of the spacer 202). The upperportion of the dislocation 611 in the first region 30 is etched away,but the lower portion of the dislocation 611 remains at the bottom ofthe first trench 320.

As shown in FIG. 13, a stress-inducing layer 370, such as a siliconphosphide (SiP) epitaxial layer or a silicon carbide (SiC) epitaxiallayer, is then formed in the trench 320. According to an embodiment ofthe present invention, the stress-inducing layer 370 may be formed usinga selective epitaxial method, but is not limited thereto. According toan embodiment of the present invention, when the stress-inducing layer370 is grown, a dislocation 711 is formed in the stress-inducing layer370.

Finally, ion implantation for forming heavily doped source and the drainmay be performed to form a source heavily doped region 302 in the firstregion 30 and a drain heavily doped region 402 in the second region 40.For example, the source heavily doped region 302 and the drain heavilydoped region 402 may be N-type heavily doped regions, thus forming anNMOS field effect transistor 3 having an asymmetric strainedsource/drain structure.

Please refer to FIG. 14 and FIG. 15. FIG. 14 and FIG. 15 show variationsin the structure of an NMOS transistor in some other embodiments of thepresent invention.

FIG. 14 differs from FIG. 13 in that the NMOS transistor structure 4 ofFIG. 14 has a plurality of dislocations 711 in its first region 30.

FIG. 15 differs from FIG. 14 in that the NMOS transistor structure 5 ofFIG. 15 may also be formed with a stress-inducing layer 370 in itssecond region 40, and the stress-inducing layer 370 in the second region40 may also be formed with dislocation 712, wherein the number of thedislocations 712 of the stress-inducing layer 370 in the second region40 is less than the number of the dislocations 711 of thestress-inducing layer 370 in the first region 30.

According to an embodiment of the present invention, as shown in FIG.15, the NMOS transistor structure 5 includes a substrate 100 having anupper surface 100 a, a first region 30 disposed in the substrate 100, asecond region 40 disposed in the substrate 100 and spaced apart from thefirst region 30, a channel region 200 between the first region 30 andthe second region 40, and a gate structure 20 on the channel region 200.There may be m dislocations 711 in the first region 30, where m is aninteger greater than or equal to 1, and there may be n dislocations 712in the second region 40, where n is an integer greater than or equal to0, and wherein m is greater than n, such as m=3, n=1. The first region30 and the second region 40 are both N-type doped regions. The secondregion 40 further includes a stress-inducing layer 370, and the ndislocations 712 are disposed in the stress-inducing layer 370. Thestress-inducing layer 370 includes a silicon phosphide layer or asilicon carbide layer.

FIG. 16 to FIG. 21 are cross-sectional views showing a method offabricating an NMOS transistor structure 6 according to still anotherembodiment of the present invention, in which the same or similarelements, structures or material layers are designated by the samenumeral numbers.

As shown in FIG. 16, first, a substrate 100, for example, a P-typesilicon substrate is also provided, but is not limited thereto. Thesubstrate 100 includes an upper surface 100 a. According to anembodiment of the present invention, a gate structure 20 is formed onthe upper surface 100 a. For example, the gate structure 20 comprises apolysilicon layer 210, a gate dielectric layer 220, and a siliconnitride cap layer 230, but is not limited thereto. A spacer 202, such asa silicon nitride spacer, may be provided on each sidewall of the gatestructure 20, but is not limited thereto.

In addition, a first region 30 and a second region 40 are respectivelydisposed in the substrate 100 on opposite sides of the gate structure20. The first region 30 and the second region 40 are separated from eachother and do not overlap each other. According to an embodiment of theinvention, the first region 30 serves as the source region of the fieldeffect transistor device and the second region 40 serves as the drainregion of the field effect transistor device.

According to an embodiment of the invention, an LDD region 301 and anLDD region 401 are respectively disposed in the first region 30 and thesecond region 40. For example, the LDD region 301 and the LDD region 401may be N-type LDD regions.

Subsequently, as shown in FIG. 17, an ion implantation process 60 isperformed to implant dopants, for example, silicon (Si), germanium (Ge)or xenon (Xe) ions into the substrate 100 in the first region 30 and thesecond region 40 to amorphize the first region 30 and the second region40, thereby forming an amorphous silicon layer 610 and an amorphoussilicon layer 620 in the first region 30 and the second region 40,respectively.

As shown in FIG. 18 and FIG. 19, a stress memorization technique (SMT)process is performed. For example, a stress film 70 is deposited on thesubstrate 100. The stress film 70 conformally covers the gate structure20, the spacers 202, the first region 30, the amorphous silicon layer610 in the first region 30, the second region 40, and the amorphoussilicon layer 620 in the second region 40. According to an embodiment ofthe present invention, the stress film 70 may include a silicon nitridelayer, a silicon oxide layer, or a silicon oxynitride layer, but is notlimited thereto. According to an embodiment of the invention, the stressfilm 70 may have a tensile stress.

Subsequently, an annealing process is performed to recrystallize theamorphous layer 610 and the amorphous layer 620, so that a dislocation611 is formed in the first region 30 and a dislocation 612 is formed inthe second region 40, as shown in FIG. 19. According to an embodiment ofthe present invention, the annealing process may be a two-step annealingprocess. For example, the temperature of the first-stage annealing isbetween 400 and 750° C., and the temperature of the second-stageannealing is greater than 900° C.

As shown in FIG. 20, the stress film 70 is then removed to reveal thegate structure 20, the spacer 202, the first region 30 and the secondregion 40. At this point, the dislocations 611, 612 formed in the firstregion 30 and the second region 40 can provide an appropriate tensilestress to the channel region 200. The steps depicted through FIGS. 6-9can be repeated such that a plurality of dislocations 611 are formed inthe first region 30, as shown in FIG. 21, to increase the source tensilestress.

Finally, ion implantation for forming heavily doped source and the drainmay be performed to form a source heavily doped region 302 in the firstregion 30 and a drain heavily doped region 402 in the second region 40.For example, the source heavily doped region 302 and the drain heavilydoped region 402 may be N-type heavily doped regions, thus forming anNMOS field effect transistor 6 having an asymmetric strainedsource/drain structure.

According to an embodiment of the present invention, as shown in FIG.21, the NMOS transistor structure 6 includes a substrate 100 having anupper surface 100 a, a first region 30 disposed in the substrate 100, asecond region 40 disposed in the substrate 100 and spaced apart from thefirst region 30, a channel region 200 between the first region 30 andthe second region 40, and a gate structure 20 on the channel region 200.There may be m dislocations 611 in the first region 30, where m is aninteger greater than or equal to 1, and there may be n dislocations 612in the second region 40, where n is an integer greater than or equal to0, and wherein m is greater than n, such as m=3, n=1. The first region30 and the second region 40 are both N-type doped regions.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

1. A method for forming a semiconductor structure, comprising: providinga substrate having an upper surface, a gate structure on the uppersurface, spacers on sidewalls of the gate structure, a first region inthe substrate, and a second region in the substrate; dry etching thefirst region and the second region to form a first trench and a secondtrench, respectively; masking the second region; wet etching the firstregion through the first trench to form a widened first trench; andforming a stress-inducing layer in the second trench and the widenedfirst trench.
 2. The method according to claim 1, wherein said maskingthe second region comprises: blanket depositing a mask layer on thesubstrate, wherein the mask layer covers the gate structure, thespacers, and the first region, and the second region; and removing aportion of the mask layer to expose the first region.
 3. The methodaccording to claim 2 further comprising: after wet etching the firstregion, removing the mask layer.
 4. The method according to claim 1,wherein the widened first trench has a hexagonal cross-sectionalprofile.
 5. The method according to claim 1, wherein the stress-inducinglayer comprises a SiGe layer.
 6. A method for forming a semiconductorstructure, comprising: providing a substrate having an upper surface, agate structure on the upper surface, spacers on sidewalls of the gatestructure, a first region in the substrate, and a second region in thesubstrate; masking the second region and amorphorizing the first region,thereby forming an amorphous layer in the first region; depositing astress film on the substrate, wherein the stress film conformally coversthe gate structure, the spacers, the first region, and the secondregion; and recrystallizing the amorphous layer thereby forming adislocation in the first region.
 7. The method according to claim 6,wherein said masking the second region and amorphorizing the firstregion comprises: forming a photoresist pattern to completely mask thesecond region; and performing an ion implantation to implant dopantsinto the first region.
 8. The method according to claim 6, wherein saidstress film comprises a silicon nitride layer, a silicon oxide layer, ora silicon oxy-nitride layer.
 9. The method according to claim 6, whereinsaid recrystallizing the amorphous layer comprises: performing anannealing process.
 10. The method according to claim 6 furthercomprising: forming a first trench in the first region; and forming astress-inducing layer in the first trench.
 11. The method according toclaim 6 further comprising: removing the stress film.
 12. Asemiconductor device, comprising: a substrate having an upper surface; afirst region in the substrate; a second region in the substrate andspaced apart from the first region; a channel region between the firstregion and the second region; a gate structure on the channel region; mdislocations in the first region, wherein m is an integer greater thanor equal to 1; and n dislocations in the second region, wherein n is aninteger greater than or equal to 0, and wherein m is greater than n. 13.The semiconductor device according to claim 12, wherein the secondregion further comprises a stress-inducing layer.
 14. The semiconductordevice according to claim 13, wherein the stress-inducing layercomprises a SiP layer or a SiC layer.
 15. The semiconductor deviceaccording to claim 12, wherein the first region and the second regionare both an N-type doped region.
 16. The semiconductor device accordingto claim 12, wherein m=3 and n=1.